The visit, facilitated by the Embassy of Estonia in India and Enterprise Estonia, marks a defining moment in the growing relationship between Estonia and Polymatech Electronics – a partnership that now spans two continents.
Polymatech incorporated its Estonian entity in August 2024, securing the premises of the former Brandner PCB OU facility in Paide as the foundation for an entirely new, purpose-built advanced electronics manufacturing campus. Over the following fifteen months, Polymatech undertook the development and fit-out of the facility and successfully commissioned the plant in November 2025. The total investment envisaged for this project is approximately €100 million, to be deployed in a phased manner through 2030 in line with Polymatech’s long-term strategic roadmap.
The Paide facility, now Polymatech’s European manufacturing hub, is fully operational and is being progressively built out into an integrated advanced electronics campus encompassing three capabilities:
1. Advanced multi-layer HDI Printed Circuit Board (PCB) manufacturing
- Built on a sprawling 5,000 sqm with a 929 sqm cleanroom equipped with advanced European machinery
- Producing up to 50,000 sqm of HDI PCBs annually (configurations up to 48 layers) for premium mobile, defence, aerospace, automotive, and semiconductor applications
- European-standard delivery in as little as 24 hours
2. Semiconductor substrate manufacturing
- Critical enabling material for next-generation chip packaging
- Supporting Europe’s drive toward greater supply chain resilience and strategic autonomy in semiconductor
3. Advanced semiconductor chip packaging
- 250 million chips per annum (initial capacity)
- Purpose-built to serve European markets, making Paide one of very few locations in Europe with indigenous, at-scale semiconductor packaging capability
- This facility will be added in 2nd half of CY 2026
From the outset, Polymatech has prioritised building local talent, underscoring its people-first approach and long-term commitment to contributing to Estonia’s economy, talent base, and innovation ecosystem. As of the first quarter of 2026, Brandner Electronics OÜ (Registry Code: 17117350) has a workforce of 27 employees. In addition, Polymatech has deployed personnel internationally, including one employee in France and two in Finland, to support its European operations. The company anticipates a progressive expansion of its workforce in line with the scale-up of operations over the coming years.
The Paide facility’s capabilities are also directly aligned with Europe’s strategic industrial ambitions, supporting the goals of the European Chips Act, which seeks to double Europe’s share of global semiconductor output by 2030.
The delegation was warmly received at the Oragadam facility by Mr. Eswara Rao Nandam, Managing Director & CEO of Polymatech Electronics. The visit included a full tour of Polymatech’s semiconductor manufacturing operations, offering the delegation a direct view of the technological depth and operational excellence that underpins the Paide investment. The visit was coordinated with the Government of Tamil Nadu, reflecting the national and state-level significance of this partnership.
“When Polymatech incorporated in Estonia in August 2024, we saw the ambition. When they commissioned a fully operational, world-class facility in November 2025. With €100 million invested and 27 Estonian engineers on board, we saw the commitment. Estonia is proud to be Polymatech’s European home.”
– Embassy of Estonia / Enterprise Estonia
“From a new company in August 2024 to a fully commissioned, cutting-edge facility by November 2025, the Paide story is a testament to what is possible when a committed investor meets a business-friendly, talent-rich nation. We are grateful to Estonia, and I can promise that this is just the beginning.”
– Mr. Eswara Rao Nandam, Managing Director & CEO, Polymatech Electronics Limited
Paide Facility Highlights
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Company Established
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August 2024
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Facility Commissioned
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November 2025
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Total Investment
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Approx. €100 million
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PCB Capacity
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50,000 sqm HDI PCBs / annum
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Board Complexity
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Up to 48 layers
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Chip Packaging
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250 million units / annum (initial)
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Substrate Manufacturing
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Semiconductor-grade substrates
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Engineers Hired
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27 local Estonian engineers
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Delivery
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Across Europe in as fast as 24 hours
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Strategic Alignment
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European Chips Act
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